- 作 者：宋长发主编；文凤息，宋若翔副主编；罗源伟，李鹏，唐仪参编
- 出 版 社：北京：国防工业出版社
- 出版年份：2012
- ISBN：9787118079524
- 注意：在使用云解压之前，请认真核对实际PDF页数与内容!
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Unit One 1
1.1 Printed circuit assembly 3
1.2 Assembly techniques 4
1.3 SMT design and assembly 6
1.4 PCB assembly flows 10
Unit Two SMC and SMD 12
2.1 Surface mount device definitions 12
2.2 Sizes of surface mount device 12
2.3 SMD chip resistors 13
2.4 SMD ceramic capacitors 14
2.5 SMD Tantalum capacitors 15
2.6 SMD MELF 16
2.7 SMD transistors 17
2.8 Mounting of Surface Mount component 17
2.9 Component size comparison 22
Unit Three Printed circuit boards 26
3.1 The types of printed circuit board 27
3.2 PCB design 30
3.3 PCBs Raw Materials 31
3.4 Drilling and plating the holes of printed circuit boards 33
3.5 Creating the printed circuit pattern on the substrate 34
3.6 Attaching the contact fingers 35
Unit Four Adhesives 39
Unit Five Types of solder paste fluxes 47
5.1 Flux and its requirement 48
5.2 Inorganic acid fluxes 48
5.3 Organic acid fluxes 49
5.4 Rosin 50
5.5 No-clean fluxes 51
Unit Six Solder alloys and applications 54
6.1 Introduction 54
6.2 Availability and type of solders 55
Unit Seven Surface Mounted Technology 68
7.1 Component Placement Machines 68
7.2 Surface Mounted Technology 71
7.3 Component pick-up head types 75
Unit Eight Techniques of solder interconnection 78
8.1 Soldering iron method 78
8.2 Hot air reflow soldering method 79
8.3 Laser reflow soldering method 80
8.4 Pulse heating method 80
8.5 IR method 80
8.6 Vapor phase soldering(VPS)method 82
8.7 Convection reflow method(air or N2 reflow) 83
8.8 Combined convection IR method 83
8.9 Flow/wave soldering method 84
8.10 The temperature profile concept 87
8.11 Pb-free soldering process 92
Unit Nine Cleaning 95
9.1 Water-soluble fluxes 95
9.2 No-clean fluxes 96
9.3 Pcb assembly cleaning 96
9.4 Pcb cleaning test 97
Unit Ten SMA inspection technique 103
10.1 Vision system of component placement machines 103
10.2 Inspection process 107
10.3 Visual inspection equipment 108
10.4 Visual inspection items 109
Unit Eleven Handling and ESD control 115
11.1 Electrostatic discharge 115
11.2 ESD and EOS 116
11.3 Requirements of static-free work station 116
附录A CP-6系列富士贴片机操作简介 121
A1.1 Machine components and operation panel 121
A1.2 Starting and Stopping the Machine 130
附录B 专业词汇 142
References 146